Single-Crystal Diamond Cutting Tool for Ultra-Precision …
Ultra-precision diamond cutting tools made of single-crystal diamond are used for processing resin molds for optical disk pickup lenses and smartphone camera lenses, as …
Grinding Grade Diamond Single Crystal Market Size
New Jersey, United States,- Grinding grade diamond single crystal refers to a high-quality diamond material primarily used for industrial grinding applications. These single crystal diamonds ...
Investigation on surface generation mechanism of single-crystal …
The ultra-precision grinding process of single-crystal silicon workpieces is crucial to obtaining wafers with high surface quality and service life. However, the quality of wafer processing is not only related to the grinding parameters but also the crystal orientations of the machined surface. In this work, the grinding process of single …
Study on micro-grinding quality in micro-grinding tool for single
Micro-grinding has a wide application for machining meso/micro parts using hard and brittle materials with high precision. In order to investigate the effect of grinding parameters and various micro-grinding tools on micro-grinding quality, experimental trials on side grinding of single crystal silicon (100 lattice orientation) were carried out using …
Experimental study of surface generation and force
By conducting micro-grinding experiments on single crystal silicon, crack length l c 's empirical formula and ductile-regime transitions are derived, 20 nm and 100 nm h m are turned out to be two critical conditions. 0.5 nm h m which equals to lattice constant is a critical line, micro-grinding forces could have different performances in these ...
A nano-MQL grinding of single-crystal nickel-base …
During the grinding of a single-crystal nickel-base superalloy, the high temperature in the grinding zone often causes thermal damage to the machined surface, which severely affects the workpiece performance. In response to this problem, nanoparticle minimum-quantity lubrication grinding with textured grinding wheels (NMQLG-TGW) is …
Formation of subsurface cracks in silicon wafers by grinding
Single-crystal silicon is an important material in the semiconductor and optical industries. However, being hard and brittle, a silicon wafer is vulnerable to subsurface cracks (SSCs) during grinding, which is detrimental to the performance and lifetime of a wafer product.
A study on the grinding subsurface metamorphic layer
To conduct the single-factor experiment of plane groove grinding on nickel-based single crystal superalloy DD5, we selected the grinding wheel speed (v s), grinding depth (a p), and feed rate (v f) as per the experiment layout presented in Table 4. We utilized a low-speed wire cutting machine to slice the processed workpiece into a …
Investigation on surface generation mechanism of single-crystal …
1. Introduction. Single-crystal silicon is the primary material in the batch-fabricated production of high-performance sensors due to its excellent advantages in mechanical and electronic properties [1], [2].The machining process is an essential method for obtaining a high-quality Si surface [3], [4], [5].In the machining process, the surface …
Defect-free Fabrication for Single Crystal Silicon Substrate …
Defect-free Fabrication for Single Crystal Silicon Substrate by Chemo-Mechanical Grinding L. Zhou 1, H. Eda 1, J. Shimizu 1, S. Kamiya 2, H. Iwase 2, S. Kimura 3 1 Faculty of Engineering, Ibaraki University, , Japan 2 Material Engineering Div.II, Toyota Motor Co., , Japan 3 Tokyo Diamond Tool Mfg. Co., Tokyo, Japan …
Micro fracture behavior of cutting edges in grinding using single
Abstract. This paper presents a micro fracture behavior of the grain cutting edge that is the most important factor controlling the grinding ability of cBN wheels during the grinding process. To grasp a self-sharpening phenomenon due to the micro fracture of the cutting edges, the wear process in grinding with single crystal cBN grains has …
A nano-MQL grinding of single-crystal nickel-base …
The texture preparation of the grinding wheel and grinding tests were carried out on the high-precision CNC grinder MGK7120 × 6. The workpiece material was single-crystal nickel-base superalloy DD5. Its chemical composition is shown in Table 1. The workpiece size was 20 mm × 7.5 mm × 10 mm, of which 20 mm × 7.5 mm was the processing …
Mirror-grinding of single-crystal diamond substrates with a …
High-efficiency mirror grinding of single-crystal diamond substrate was investigated. • A rotary grinder with a #15000 diamond wheel was used for mirror …
Plastic deformation mechanism of grinding subsurface of
Single-crystal materials have emerged as a new class of materials widely utilized in the aerospace field. This paper aims to study nickel-based single crystal superalloy DD5, a notoriously challenging material to process. Among the various machining techniques, grinding can achieve superior surface quality with minimal size …
Grinding forces in micro slot-grinding (MSG) of single crystal …
A predictive model of grinding force in MSG of three different orientations of single crystal sapphire: C-plane {0001}, A-plane {11 2 ¯ 0} and R-plane {1 1 ¯ 02} are …
Ultra-precision surface grinding of PMN-PT relaxor-based …
It was cut into single crystals of (0 0 1) plane and 4 mm × 13 mm × 0.8 mm thick by a diamond saw wheel, then lapped to parallel and pasted on an alumina plate of 100 mm diameter and 7 mm thickness with wax. The lapped surface roughness was 620 nm Ra. Fig. 2 shows the definition of the grinding direction on the single crystal sample.
Deformation mechanism and force modelling of the grinding of YAG single
During grinding, slippages occurred along (0 0 1) crystal planes which are the close-packed plane of the YAG single crystal, i.e. the most likely to slip under a compressive stress. Since slippage occurred along the same crystal plane, i.e. the slip planes were parallel to each other in the subsurface, therefore, no brittle removal …
Grinding forces in micro slot-grinding (MSG) of single crystal sapphire
Micro-slot grinding (MSG) is an important processing method for the micro-machining of hard brittle crystalline materials. Modelling the MSG of crystal material is necessary to understand its precision micro-machining aspects. In this paper, a predictive model is developed for the grinding force in MSG in three different orientations of …
Creep-feed grinding of single crystal nickel-base …
work presents a comprehensive study on creep-feed grinding of single crystal nickel-base turbine blade r-tree roots by using microcrystalline alumina abrasive wheels. The eects of grinding parameters on tool wear, grinding force, grind-ing temperature, and surface integrity were then evaluated and discussed.
Surface gradient structures in single-crystal nickel alloy …
The gradient structures in surface layer of single-crystal nickel alloy (SX alloy) were produced (i.e., nanograin, submicron grain and coarse single crystal of bulk material) by means of ultrasonic-assisted high-speed grinding (UAHSG). The surface layer with a grain size gradient (from 29.7 to 111.8 nm) along depth from the treated surface …
Effects of processing parameters and grinding direction
All samples employed in this study were optical-grade CVD single crystal diamonds with a regular cuboid size of (7 × 7 × 0.3) mm 3, which were provided by Zhengzhou Research Institute for Abrasives & Grinding Co. LTD. (Zhengzhou, China).The two main surfaces were oriented along the (100) crystal plane, while the other four …
Grinding-Triggered Single Crystal-to-Single Crystal …
We first report single crystal X-ray analysis of ground crystals of mechanochromic luminescence (MCL) that shows single crystal-to-single crystal transformation (SCSCT). Single crystals of [ZnL2] (1-SG, HL = 2-[[[4-(2-benzoxazolyl)phenyl]imino]-methyl]-5-(diethylamino)-phenol) were obtained upon slight grinding of single crystals of …
Study on the chip formation in grinding of nickel-based single-crystal
According to the significant anisotropy of nickel-based single-crystal superalloy, a three-dimensional single-abrasive grinding model based on the Hill model was developed. In work, the change of the actual grinding thickness (ag) of abrasive is taken into account in establishing the model. In addition, a combination of theoretical …
Grinding mechanism and surface quality evaluation strategy …
Abstract. This paper investigated the removal mechanism and surface quality of single crystal 4 H-SiC during the grinding process, as well as the impact of the measurement …
Micromachines | Free Full-Text | Laser Grinding of Single …
In this paper, we first report the laser grinding method for a single-crystal silicon wafer machined by diamond sawing. 3D laser scanning confocal microscope …
Experimental investigation on surface integrity and fatigue
For single-crystal materials, Cai et al. carried out grinding of DD5 and found that severe plastic flow occurred on the grinding surface. The depth of plastic deformation layer was about 2 μm on the grinding subsurface, and the matrix phase γ, and the strengthening phase γ ′ in the plastic deformation layer twist seriously.
Grinding of silicon wafers: A review from historical …
Only single-side grinders that grind one side of the wafer can be used for back grinding. Initially used ones are of Blanchard type and creep-feed type (rotary-table vertical-spindle) [37], [38], [39]. Fig. 3 illustrates the Blanchard-type wafer grinder. A rotary table has several chucks aligned along a circle, and each chuck holds a silicon wafer.
Study on machining performance in grinding of Ni-base …
The grinding process, as an important manufacturing method for Ni-base single crystal superalloys, can obtain lower surface roughness and better surface quality.
Study on nickel-based single crystal superalloy DD6 …
The weight of single crystal superalloy workpiece was weighed by Meilen MTQ electronic balance before and after grinding, so as to obtain the grinding removal weight. The density of single crystal superalloy DD6 is 8.78 g/cm 3, and the grinding removal volume can be obtained by the formula: m = ρV. The grinding width of the abrasive belt is 10 ...
Phase transformation of single crystal silicon induced by grinding …
Phase transformation of single crystal silicon (Si) was investigated under various grinding conditions using high-resolution transmission electron microscopy. Nanocrystals with sizes ranging from 6 to 20 nm of diamond cubic silicon (Si-I) and high-pressure phase (Si-III) were observed in the grinding-induced amorphous Si layers. …